Azimuth currently has light-volume design and development capabilities for miniature circuit boards containing integrated circuits and passive devices in both through-hole and surface-mount packages. This includes, but is not limited to, TSSOP (25 mil pitch), 0603 packages as well as surface-mount connectors and other miniature components. In-house equipment includes a 2x (20 power) and 6x (60 power) dual-lens microscope and a rework soldering station suitable for small to medium-scale IC packages of up to one-hundred pins. This includes capabilities for PLCC (plastic-Leaded Chip Carrier) and QFP (Quad Flat Pack) packages. While this tool can be used for soldering, also available is a tweezer hand-piece useful for removing a wide range of surface-mount components from printed circuit boards. Azimuth also has de-soldering capabilities with a station suitable for removing through-hole components from circuit cards including headers and Dual-Inline Package (DIP) Integrated Circuits (IC’s).

Surface-mount experience enables smaller designs than previously possible and miniaturization of circuits. This allows for greater packaging flexibility for the overall system design. Software support exists for multi-layer designs of up to 64 layers (32 layer pairs). Capabilities also include advanced routing technology, such as rip-up and reroute.

Current engineering design experience includes layout of multi-layer boards containing ultra-fine pitch (20 mil spacing) components with inner power and ground planes that decrease electrical noise in digital circuits while providing clean power rails throughout the board. Previous designs include redundant power supplies, analog and digital design, embedded devices and systems, and portable systems with built-in portable (battery) power packs with integral charging circuitry including lithium-ion designs.

Additionally, software support allows simulation of electronic designs using SPICE. This capability allows for design verification prior to fabrication.